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http://acikerisim.ktu.edu.tr/jspui/handle/123456789/5586
Başlık: | Investigation on properties of wood plastic composite made of treated wood flour with tanalith e and poly lactic acid (pla) |
Diğer Başlıklar: | Tanalith-e ile muamele edilmiş odun unundan ve polilaktik asitten (pla) yapilan odun plastik kompozitlerinin özelliklerinin incelenmesi |
Yazarlar: | Dalu, Mohammed |
Anahtar kelimeler: | Mechanical and Physical Properties, Polylactic acid, Tanalith E, Thermal stability;FizikselveMekanik Özellikler, Polilaktik asit, Tanalith E, Termal Kararlılık |
Yayın Tarihi: | 2017 |
Yayıncı: | Karadeniz Teknik Üniversitesi / Fen Bilimleri Enstitüsü |
Özet: | The purpose of this study to investigate on the properties of Wood flour -PLA composites. Wood flour -PLA composites reinforced with 30, 40, and 50% of Pinus sylvestris L. wood flour were prepared by using twin-screw extruder. Part of the wood flour was treated with 3% of Tanalith E solution before being used for the composite preparation and the other was used without treatment. The density and void volume fraction composites were determined. The composite contains 30% of untreated wood flour absorbed the least amount of water and the least thickness swelling compared to all the other formulations. The highest value of tensile and flexure modulus at 50% of untreated wood flour content while tensile and flexure strength at 30% of untreated wood flour content in composites. Thermal properties of Wood flour -PLA composites were measured using the thermo gravimetric analysis and differential thermal analysis. Presence of WF in thermoplastic matrix reduced the degradation temperature of the composites while the increased weight loss. Results indicate that the mechanical properties of the chemically treated wood flour-PLA composites were found to be lower than those of the untreated. The water absorption test showed that composite prepared from the chemically treated wood flour absorbed higher amount of water compared to the untreated wood flour composite. This indicate the copper partly inhibit wood bonding and causes presence of high content of voids in the chemical treated wood flour compared to that of untreated. High voids in the chemically treated wood was also observed SEM studies. The results clearly show that the properties of WPCs depend on the wood flour content and also the treatment given to the wood. |
URI: | http://acikerisim.ktu.edu.tr/jspui/handle/123456789/5586 |
Koleksiyonlarda Görünür: | Orman Endüstri Mühendisliği |
Bu öğenin dosyaları:
Dosya | Açıklama | Boyut | Biçim | |
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467974.pdf | 9.45 MB | Adobe PDF | ![]() Göster/Aç |
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